We are needing to use a soldered down memory for logging and data storage on our project. We are thinking about using something like the N25Q256A13EF840E Nor flash from micron that is on the DK board or the W25Q64FVSSIG that is on the SK board. Or for that matter something from one of the other vendors. My question is with the Qspi parts that are on both the SK and DK dev boards and their drivers. Both are in the no longer available status, or last time buy status. But in most cases, when replacing those memorys with mainly larger in production ones, what all needs to be done with the synergy drivers if anything? Are things like wear leveling need to be done by the device, or does the driver preform those tasks? Trouble with these kinds of memories is that they are not in production for a very long period of time. Like today, the parts on the dev boards are no longer available.
Now with that being said, are the QSPI NOR flashes better supported or is there better driver and FileX support for say SLC NAND flash parallel memories (like a NAND512W3A2SNXE) with in the Synergy ecosystem? If one was to use a parallel NAND flash are there any drivers available that are easily used with FileX? I guess what Im asking is what is the simplest way to go as far as the drivers and FileX is concerned with memories that we will solder to the board.
How are the drivers interfaced with FileX. Are there any Renesas developer demos using the Qspi from the SK or DK boards with FileX? To date I have made use of the usb host class storage, with its integration with FileX. That has been nice to use, and Im hoping its close to that easy with respect to QSPI memories.
Hi Matt, Hope things are going well for you and your project. Maybe you've already considered these and ruled them out for other reasons, but wanted to suggest using eMMC as another possibility. We use eMMC flash + FileX in our project (still on SSP 1.1.3). The eMMC flash part has embedded wear leveling so that part is taken care of (I don't think FileX or the Synergy drivers take care of wear leveling for you for basic NAND flashes). Because eMMC is a standard for the part pin-outs (a few to choose from) as well as the electrical and communications standards, finding a replacement part should in theory be much more straightforward (we have not found that to be completely true but at least there's the intent with eMMC). The DK board has a Micron eMMC part on it which is also going obsolete. We are using a Flexxon eMMC for our project using Synergy which has good industrial lifetime promised (>= 10 years). Hope this helps, Tim
In reply to Tim:
In reply to rupertm:
We have had good success with the Flexxon FEMC008GTTE7-T13. This is an 8GB, 100-ball part. The eMMC standard also allows for 153-ball parts but those have a higher density pin-out and we were not comfortable going there with our board suppliers. If you have a good board manufacturer you will have more choices in the 153-ball package. We found the cost of Flexxon to be lowest. We also tried Greenliant but had some issues getting their part to work with Synergy (required some driver modifications) and is seems much slower than the Flexxon part. Smart Modular makes an inter-poser module that has the 153-ball part on a 100-ball carrier. Have not tried this with Synergy. Micron only has 153-ball parts for long-term availability now so we didn't give them a try (It did/does work well on the DK devkit).
These 100-ball parts are pretty large (bigger than the S7G2 BGA we are using) so if you are space-constrained, it may be another reason to look at the 153-ball or even falling back to the QSPI flash.
I have only worked with the eMMC flash with SSP 1.1.3. Have not made the jump to 1.2.x yet due to other SSP modifications we've had to make and proximity to our product release date.
Hope this helps,
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